Patent Assignment
Reel/Frame 029801/0655
Assignment of Assignor's Interest
Recorded: 2013-02-13
Pages: 4
Assignors
ZANMA, MASAHIRO
Executed: 2013-01-25
FURUTANI, TOSHIKI
Executed: 2013-01-25
MIKADO, YUKINOBU
Executed: 2013-01-25
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board with Built-in Electronic Component and Method for Manufacturing the Same