Patent Assignment
Reel/Frame 029817/0420
Assignment of Assignor's Interest
Recorded: 2013-02-15
Pages: 5
Assignors
CHENG, CHIA-PIN
Executed: 2012-12-24
CHIEN, JUNG-LIANG
Executed: 2012-12-24
CHAO, CHIH-KANG
Executed: 2012-12-24
JENG, CHI-CHERNG
Executed: 2012-02-24
CHEN, HSIN-CHI
Executed: 2012-12-24
WANG, YING-LANG
Executed: 2012-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
System and Method for Die to Die Stress Improvement