Patent Assignment
Reel/Frame 029836/0365
Assignment of Assignor's Interest
Recorded: 2013-02-18
Pages: 6
Assignors
JUNG, JAE-MIN
Executed: 2013-01-11
HAN, SANG-UK
Executed: 2013-01-11
LEE, KWANJAI
Executed: 2013-01-11
CHO, KYONGSOON
Executed: 2013-01-11
HA, JEONG-KYU
Executed: 2013-01-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package and Device Assembly Including the Same