Patent Assignment
Reel/Frame 029856/0081
Assignment of Assignor's Interest
Recorded: 2013-02-22
Pages: 2
Assignors
LEE, SANG-KWAN
Executed: 2013-02-22
LEE, SANG-BOK
Executed: 2013-02-22
YUN, JUNG-YEUL
Executed: 2013-02-22
Assignee
KOREA INSTITUTE OF MACHINERY & MATERIALS
156 GAJEONGBUK-RO, YUSEONG-GU, DAEJEON, 305-343, KOREA, REPUBLIC OF
Covered Property
(1)
Composite Heat-Dissipation Substrate and Manufacturing Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.