IP Library Assignment 029856/0081
Patent Assignment
Reel/Frame 029856/0081

Assignment of Assignor's Interest

Recorded: 2013-02-22 Pages: 2
Assignors
LEE, SANG-KWAN
Executed: 2013-02-22
LEE, SANG-BOK
Executed: 2013-02-22
YUN, JUNG-YEUL
Executed: 2013-02-22
Assignee
KOREA INSTITUTE OF MACHINERY & MATERIALS
156 GAJEONGBUK-RO, YUSEONG-GU, DAEJEON, 305-343, KOREA, REPUBLIC OF
Covered Property (1)
Composite Heat-Dissipation Substrate and Manufacturing Method of the Same
Patent: 8,920,707 →
Application: 13/726,378 →
Publication: US 2013/0213629
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2021
From: KOREA INSTITUTE OF MACHINERY & MATERIALS
To: KOREA INSTITUTE OF MATERIALS SCIENCE
Reel/Frame 055137/0489 →