Patent Assignment
Reel/Frame 029858/0365
Assignment of Assignor's Interest
Recorded: 2013-02-22
Pages: 4
Assignor
SASAKI, YASUHARU
Executed: 2013-02-22
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Cooling System, Substrate Processing Apparatus Having Cooling System and Cooling Method