Patent Assignment
Reel/Frame 029871/0545
Assignment of Assignor's Interest
Recorded: 2013-02-25
Pages: 3
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Stackable Semiconductor Package and Manufacturing Method Thereof