Patent Assignment
Reel/Frame 029873/0185
Assignment of Assignor's Interest
Recorded: 2013-02-26
Pages: 5
Assignors
FOSTER, RANDY C.
Executed: 2012-12-03
DIEFENDERFER, RANDALL R.
Executed: 2012-12-10
KAMSICKAS, MICHAEL M.
Executed: 2012-12-13
Assignee
DAYCO IP HOLDINGS, LLC
2025 W. SUNSHINE STREET, SUITE L145, SPRINGFIELD, MISSOURI, 65807
Covered Property
(1)
Modular Mandrel for a Molding System
Application:
13/693,480 →
Publication:
US 2013/0146745
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 19, 2012
From: FOSTER, RANDY C.; DIEFENDERFER, RANDALL R.; KAMSICKAS, MICHAEL M.
To: DAYCO IP HOLDINGS, LLC
Reel/Frame 029503/0105 →
Security Agreement
Dec 16, 2013
From: DAYCO IP HOLDINGS, LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031817/0737 →
Security Agreement
Dec 17, 2013
From: DAYCO IP HOLDINGS, LLC
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 031832/0554 →
Patent Release (Reel:03817/Frame:0737)
May 22, 2017
From: BANK OF AMERICA, N.A, AS COLLATERAL AGENT
To: DAYCO IP HOLDINGS, LLC; DAYCO PRODUCTS, LLC
Reel/Frame 042523/0770 →
Release (Reel 031832 / Frame 0554)
Oct 4, 2022
From: BANK OF AMERICA, N.A.
To: DAYCO IP HOLDINGS, LLC; DAYCO CANADA CORP
Reel/Frame 061596/0442 →