Patent Assignment
Reel/Frame 029875/0278
Assignment of Assignor's Interest
Recorded: 2013-02-26
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2012-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package Assembly and Methods for Forming the Same