IP Library Assignment 029894/0222
Patent Assignment
Reel/Frame 029894/0222

Assignment of Assignor's Interest

Recorded: 2013-02-28 Pages: 11
Assignors
DAUBENSPECK, TIMOTHY H.
Executed: 2013-02-22
GAMBINO, JEFFREY P.
Executed: 2013-02-21
HAUSER, MICHAEL J.
Executed: 2013-02-22
MUZZY, CHRISTOPHER D.
Executed: 2013-02-22
SAUTER, WOLFGANG
Executed: 2013-02-26
SULLIVAN, TIMOTHY D.
Executed: 2013-02-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Thermal via for 3D Integrated Circuits Structures
Patent: 8,933,540 →
Application: 13/780,033 →
Publication: US 2014/0239457