IP Library Assignment 029894/0638
Patent Assignment
Reel/Frame 029894/0638

Assignment of Assignor's Interest

Recorded: 2013-02-28 Pages: 4
Assignors
YUASA, KAZUHIRO
Executed: 2013-02-15
FUKUDA, MASANAO
Executed: 2013-02-15
SASAKI, TAKAFUMI
Executed: 2013-02-15
MEGAWA, YASUHIRO
Executed: 2013-02-18
MINAMI, MASAYOSHI
Executed: 2013-02-15
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Processing Substrate and Method of Manufacturing Semiconductor Device
Patent: 8,901,013 →
Application: 13/813,493 →
Publication: US 2013/0157474
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →