Patent Assignment
Reel/Frame 029899/0162
Assignment of Assignor's Interest
Recorded: 2013-02-28
Pages: 2
Assignor
HUNG, WENSEN
Executed: 2013-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3DIC Package Comprising Perforated Foil Sheet