Patent Assignment
Reel/Frame 029930/0787
Assignment of Assignor's Interest
Recorded: 2013-03-06
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-02-21
LIN, SHIH TING
Executed: 2013-02-21
YU, CHEN-HUA
Executed: 2013-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Carrier Warpage Control for Three Dimensional Integrated Circuit (3DIC) Stacking