Patent Assignment
Reel/Frame 029931/0558
Assignment of Assignor's Interest
Recorded: 2013-03-06
Pages: 4
Assignors
LEE, JIN WOO
Executed: 2013-01-29
CHAE, EUN HYUK
Executed: 2013-01-29
LEE, BYOUNG HWA
Executed: 2013-01-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Embedded Multilayer Ceramic Electronic Component and Printed Circuit Board Having Embedded Multilayer Ceramic Electronic Component