Patent Assignment
Reel/Frame 029935/0780
Assignment of Assignor's Interest
Recorded: 2013-03-06
Pages: 2
Assignors
PENG, CHAO-HSIEN
Executed: 2013-03-01
HUANG, TSUNG-MIN
Executed: 2013-03-04
LEE, HSIANG-HUAN
Executed: 2013-03-04
SHUE, SHAU-LIN
Executed: 2013-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Forming Interconnect Structure That Avoids via Recess