Patent Assignment
Reel/Frame 029937/0776
Assignment of Assignor's Interest
Recorded: 2013-03-07
Pages: 7
Assignors
SHIN, DONG-JAE
Executed: 2013-01-17
BYUN, HYUN-IL
Executed: 2013-01-17
LEE, KWANG-HYUN
Executed: 2013-01-17
CHO, KWAN-SIK
Executed: 2013-01-17
JI, HO-CHUL
Executed: 2013-01-17
PYO, JUNG-HYUNG
Executed: 2013-01-17
HA, KYOUNG-HO
Executed: 2013-01-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Semiconductor Device Including the Same