IP Library Assignment 029987/0257
Patent Assignment
Reel/Frame 029987/0257

Assignment of Assignor's Interest

Recorded: 2013-03-13 Pages: 3
Assignor
WANG, SHIANG-BAU
Executed: 2011-02-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 324, TAIWAN
Covered Property (1)
End-To-End Gap Fill Using Dielectric Film
Patent: 8,759,919 →
Application: 13/800,663 →
Publication: US 2013/0193519
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →