Patent Assignment
Reel/Frame 029995/0790
Assignment of Assignor's Interest
Recorded: 2013-03-14
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of forming a through via structure