Patent Assignment
Reel/Frame 029999/0518
Assignment of Assignor's Interest
Recorded: 2013-03-14
Pages: 6
Assignors
MAEDA, SHIGENOBU
Executed: 2013-03-12
FUKUTOME, HIDENOBU
Executed: 2013-03-12
KO, YOUNG-GUN
Executed: 2013-03-12
JEONG, JOO-HYUN
Executed: 2013-03-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Embedded Strain-Inducing Pattern and Method of Forming the Same