IP Library Assignment 030000/0676
Patent Assignment
Reel/Frame 030000/0676

Assignment of Assignor's Interest

Recorded: 2013-03-14 Pages: 2
Assignor
YANG, SEUNG TAEK
Executed: 2013-03-11
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Substrate Incuding A Dam For Semiconductor Package, Semiconductor Package Using The Same, And Manufacturing Method Thereof
Patent: 9,171,813 →
Application: 13/827,289 →
Publication: US 2014/0183724
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →