Patent Assignment
Reel/Frame 030003/0703
50% of Interest of Right Assignment
Recorded: 2013-03-14
Pages: 2
Assignor
DENSO CORPORATION
Executed: 2013-03-04
Assignee
SPP TECHNOLOGIES CO., LTD.
OFFICE TOWER Y 8F, 1-8-11 HARUMI, CHUO-KU, TOKYO, 104-6108, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device and Apparatus for Manufacturing Semiconductor Device
Application:
13/095,048 →
Publication:
US 2012/0276746
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 27, 2011
From: HIKIDA, YUJI; MIYASHITA, KOUICHI
To: DENSO CORPORATION
Reel/Frame 026186/0712 →
Assignment of Assignor's Interest
Mar 14, 2013
From: HIKIDA, YUJI; MIYASHITA, KOUICHI; MURAKAMI, SHOICHI
To: DENSO CORPORATION
Reel/Frame 030000/0104 →
Change of Address
Jun 25, 2013
From: SPP TECHNOLOGIES CO., LTD. (FORMERLY OF OFFICE TOWER Y 8F, 8-11, HARUMI 1-CHOME, CHUO-KU, TOKYO)
To: SPP TECHNOLOGIES CO., LTD.
Reel/Frame 030677/0353 →