Patent Assignment
Reel/Frame 030020/0110
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Optoelectronic Integrated Package Module and Method of Manufacturing the Same