Patent Assignment
Reel/Frame 030031/0257
Assignment of Assignor's Interest
Recorded: 2013-03-18
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-03-07
HUNG, JUI-PIN
Executed: 2013-03-07
CHENG, LI-HUI
Executed: 2013-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Die Package with Openings Surrounding End-Portions of Through Package Vias (Tpvs) and Package on Package (Pop) Using the Die Package