Patent Assignment
Reel/Frame 030031/0509
Assignment of Assignor's Interest
Recorded: 2013-03-18
Pages: 5
Assignors
TSENG, TZYY-JANG
Executed: 2012-11-02
HU, DYI-CHUNG
Executed: 2012-11-02
CHAN, YING-CHIH
Executed: 2012-11-02
Assignee
UNIMICRON TECHNOLOGY CORPORATION
NO 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property
(1)
Through-Holed Interposer, Packaging Substrate, and Methods of Fabricating the Same