Patent Assignment
Reel/Frame 030036/0453
Assignment of Assignor's Interest
Recorded: 2013-03-18
Pages: 3
Assignors
KIM, JI EUN
Executed: 2013-03-14
JOH, CHEOL HO
Executed: 2013-03-14
SHIN, HEE MIN
Executed: 2013-03-14
LEE, KYU WON
Executed: 2013-03-14
CHO, CHONG HO
Executed: 2013-03-14
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Semiconductor Chips Having Protrusions and Methods of Fabricating the Same