Patent Assignment
Reel/Frame 030049/0845
Assignment of Assignor's Interest
Recorded: 2013-03-20
Pages: 2
Assignee
TOKUYAMA CORPORATION
1-1, MIKAGE-CHO, SHUNAN-SHI, YAMAGUCHI, 745-8648, JAPAN
Covered Property
(1)
Metallized via-Holed Ceramic Substrate, and Method for Manufacture Thereof