Patent Assignment
Reel/Frame 030056/0309
Assignment of Assignor's Interest
Recorded: 2013-03-21
Pages: 2
Assignor
CUI, HUA
Executed: 2013-02-22
Assignee
EKC TECHNOLOGY, INC.
2520 BARRINGTON COURT, HAYWARD, CALIFORNIA, 94545
Covered Property
(1)
Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.