Patent Assignment
Reel/Frame 030064/0813
Assignment of Assignor's Interest
Recorded: 2013-03-22
Pages: 7
Assignors
HUNG, CHING-WEN
Executed: 2013-03-14
HUANG, CHIH-SEN
Executed: 2013-03-14
TSAO, PO-CHAO
Executed: 2013-03-14
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Process Thereof