Patent Assignment
Reel/Frame 030075/0707
Assignment of Assignor's Interest
Recorded: 2013-03-25
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2013-03-18
TSAI, HAO-YI
Executed: 2013-03-18
LII, MIRNG-JI
Executed: 2013-03-18
YU, CHEN-HUA
Executed: 2013-03-18
YU, TSUNG-YUAN
Executed: 2013-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
System and Method for an Improved Interconnect Structure