IP Library Assignment 030077/0940
Patent Assignment
Reel/Frame 030077/0940

Assignment of Assignor's Interest

Recorded: 2013-03-25 Pages: 2
Assignors
NOMOTO, RYUJI
Executed: 2013-03-15
YONEDA, YOSHIYUKI
Executed: 2013-03-15
NAKAMURA, KOICHI
Executed: 2013-03-15
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23, SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Encapsulated Semiconductor Chips with Wiring Including Controlling Chip and Method of Making the Same
Patent: 9,041,186 →
Application: 13/849,248 →
Publication: US 2013/0299845
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 17, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035453/0904 →