IP Library › Assignment 035453/0904
Patent Assignment
Reel/Frame 035453/0904

Assignment of Assignor's Interest

Recorded: 2015-04-17 Pages: 6
Assignor
FUJITSU SEMICONDUCTOR LIMITED
Executed: 2015-03-02
Assignee
SOCIONEXT INC.
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Properties (53)
Semiconductor Wafer and Method of Testing the Same
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Application: 11/829,388 →
Publication: US 2008/0036485
Processor and Information Processing System
Application: 12/795,478 →
Publication: US 2010/0318766
Semiconductor Device and Method for Manufacturing the Same
Patent: 8,952,538 →
Application: 12/975,961 →
Publication: US 2011/0156248
Simulation Apparatus, Method, and Computer-Readable Recording Medium
Patent: 9,058,207 →
Application: 13/198,828 →
Publication: US 2012/0204184
Semiconductor Device
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Publication: US 2012/0223392
Semiconductor Device and Method of Producing Semiconductor Device
Application: 13/463,399 →
Publication: US 2012/0220103
Semiconductor Device Having Antenna Element and Method of Manufacturing Same
Patent: 8,994,153 →
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Publication: US 2013/0015564
Semiconductor Device and Manufacturing Method Therefor
Patent: 9,142,516 →
Application: 13/525,719 →
Publication: US 2013/0026649
Audio Signal Encoding Method and Device
Patent: 9,224,401 →
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Publication: US 2013/0034233
Image Processor, Image Pickup Apparatus, Image Pickup System and Data Processing Method
Patent: 9,105,089 →
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Publication: US 2013/0038754
Method and Apparatus for Peeling Electronic Component
Patent: 8,991,464 →
Application: 13/588,506 →
Publication: US 2012/0312482
Semiconductor Device and Method for Fabricating the Same
Application: 13/668,623 →
Publication: US 2013/0134574
Picture Detection Device, Picture Recording Device, Picture Recording/Reproduction Device, Picture Detection Method, Picture Recording Method, and Picture Recording/Reproduction Method
Application: 13/669,678 →
Publication: US 2013/0156308
Constant Voltage Circuit
Patent: 9,188,998 →
Application: 13/678,629 →
Publication: US 2013/0134954
Semiconductor Device with High Breakdown Voltage and Manufacture Thereof
Patent: 8,981,476 →
Application: 13/710,837 →
Publication: US 2013/0168768
Storage Body and Reel
Patent: 8,875,895 →
Application: 13/738,465 →
Publication: US 2013/0193016
Semiconductor Storage Device and Method of Manufacturing the Same
Patent: 9,018,076 →
Application: 13/746,304 →
Publication: US 2013/0137239
Method of Manufacturing Semiconductor Device Including Semiconductor Elements Connected to Each Other
Application: 13/775,279 →
Publication: US 2013/0164889
Encapsulated Semiconductor Chips with Wiring Including Controlling Chip and Method of Making the Same
Patent: 9,041,186 →
Application: 13/849,248 →
Publication: US 2013/0299845
Manufacturing Method of Semiconductor Device
Patent: 9,425,088 →
Application: 13/862,381 →
Publication: US 2013/0224912
Semiconductor Device and Method for Manufacturing the Same
Patent: 9,691,676 →
Application: 13/949,503 →
Publication: US 2014/0027920
Semiconductor Device and Method of Manufacturing the Same
Patent: 9,331,035 →
Application: 13/962,301 →
Publication: US 2014/0042613
Semiconductor Device and Manufacturing Method of Semiconductor Device
Application: 13/971,314 →
Publication: US 2014/0061887
Semiconductor Device, Electronic Device and Method for Fabricating the Semiconductor Device
Patent: 9,385,092 →
Application: 13/972,480 →
Publication: US 2014/0084439
Semiconductor Device and Method for Fabricating the Same
Application: 14/085,124 →
Publication: US 2014/0077392
Method for Manufacturing a Semiconductor Device Having Multiple Heat Sinks
Patent: 9,224,711 →
Application: 14/133,859 →
Publication: US 2014/0197533
Semiconductor Device Having a High Frequency External Connection Electrode Positioned Within a via Hole
Patent: 9,076,789 →
Application: 14/148,202 →
Publication: US 2014/0117562
Semiconductor Device Manufacturing Method
Patent: 8,980,692 →
Application: 14/156,671 →
Publication: US 2014/0187000
Semiconductor Device and Manufacturing Method of the Same
Patent: 9,190,354 →
Application: 14/157,714 →
Publication: US 2014/0217567
Semiconductor Device Including Two Groove-Shaped Patterns
Patent: 9,105,640 →
Application: 14/169,649 →
Publication: US 2014/0145335
Semiconductor Device Including Two Groove-Shaped Patterns That Include Two Bent Portions
Patent: 9,082,771 →
Application: 14/169,717 →
Publication: US 2014/0145336
Ball Grid Array Semiconductor Device and Its Manufacture
Application: 14/184,352 →
Publication: US 2014/0170814
Semiconductor Device
Patent: 9,472,482 →
Application: 14/185,030 →
Publication: US 2014/0167246
Bonding Apparatus and Bonding Method
Patent: 9,010,615 →
Application: 14/249,852 →
Publication: US 2014/0217153
Method for Manufacturing a Semiconductor Device Having Moisture-Resistant Rings Being Formed in a Peripheral Region.
Application: 14/286,253 →
Publication: US 2014/0273453
Semiconductor Device
Patent: 9,343,566 →
Application: 14/292,136 →
Publication: US 2015/0001621
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,412,696 →
Application: 14/304,088 →
Publication: US 2014/0291861
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,406,610 →
Application: 14/304,139 →
Publication: US 2014/0291862
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,406,611 →
Application: 14/304,186 →
Publication: US 2014/0291863
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,412,697 →
Application: 14/304,225 →
Publication: US 2014/0291864
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,412,698 →
Application: 14/310,244 →
Publication: US 2014/0299960
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,224,689 →
Application: 14/310,338 →
Publication: US 2014/0327143
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,502,353 →
Application: 14/310,612 →
Publication: US 2014/0306346
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,224,690 →
Application: 14/310,680 →
Publication: US 2014/0299987
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,406,612 →
Application: 14/312,867 →
Publication: US 2014/0299993
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,406,613 →
Application: 14/313,010 →
Publication: US 2014/0299996
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,412,699 →
Application: 14/313,024 →
Publication: US 2014/0299994
Semiconductor Device
Patent: 9,287,857 →
Application: 14/337,514 →
Publication: US 2014/0333363
Semiconductor Device and Fabrication Method Thereof
Patent: 9,112,027 →
Application: 14/468,519 →
Publication: US 2014/0361340
Semiconductor Device and Method for Manufacturing the Same
Patent: 9,893,029 →
Application: 14/587,521 →
Publication: US 2015/0118841
Semiconductor Intergrated Circuit Apparatus and Manufacturing Method for Same
Patent: 9,935,097 →
Application: 14/594,848 →
Publication: US 2015/0200191
Capacitor Array, Ad Converter and Semiconductor Device
Patent: 9,148,167 →
Application: 14/605,434 →
Publication: US 2015/0236711
Semiconductor Device with High Breakdown Voltage and Manufacture Thereof
Patent: 9,520,326 →
Application: 14/614,795 →
Publication: US 2015/0147855
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 1, 2007
From: NAGAI, KOUICHI
To: FUJITSU LIMITED
Reel/Frame 019630/0439 →
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Assignment of Assignor's Interest Jun 16, 2010
From: TSUJI, MASAYUKI
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 024542/0339 →
Change of Name Sep 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025046/0478 →
Assignment of Assignor's Interest Dec 23, 2010
From: MATSUKI, HIROHISA
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025562/0710 →
Assignment of Assignor's Interest Sep 6, 2011
From: TERASHIMA, HIROSHI; NAKAMURA, YASUKI; KUYA, RYO; YOSHINO, TATSUYA
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 026861/0010 →
Assignment of Assignor's Interest Feb 15, 2012
From: OKADA, HIROKAZU
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027710/0030 →
Assignment of Assignor's Interest Jun 13, 2012
From: MATSUKI, HIROHISA; SAKUMA, MASAO
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028367/0525 →
Assignment of Assignor's Interest Jun 19, 2012
From: TAKENAKA, MASASHI; YAMAMOTO, KATSUYOSHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028399/0104 →
Assignment of Assignor's Interest Aug 1, 2012
From: FUJITA, TOMOYA; ASAMI, MARI; ONO, JUN
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028694/0764 →
Assignment of Assignor's Interest Aug 7, 2012
From: WATARAI, YUJI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028742/0267 →
Assignment of Assignor's Interest Aug 9, 2012
From: YAMADA, TOMOYUKI; USHIDA, FUMIO; TAKEDA, SHIGETOSHI; AWAYA, TOMOHARU
To: FUJITSU LIMITED
Reel/Frame 028754/0271 →
Assignment of Assignor's Interest Aug 13, 2012
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 028771/0242 →
Assignment of Assignor's Interest Aug 14, 2012
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJISTU SEMICONDUCTOR LIMITED
Reel/Frame 028781/0785 →
Assignment of Assignor's Interest Aug 20, 2012
From: KONNO, YOSHITO; YAMADA, YUTAKA
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 028812/0265 →
Assignment of Assignor's Interest Aug 22, 2012
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028828/0620 →
Assignment of Assignor's Interest Nov 6, 2012
From: ABE, AKIO
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 029250/0032 →
Assignment of Assignor's Interest Nov 7, 2012
From: IHARA, TAKUMI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 029254/0038 →
Assignment of Assignor's Interest Dec 12, 2012
From: TAKADA, KAZUHIKO
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 029452/0562 →
Assignment of Assignor's Interest Dec 12, 2012
From: YANO, YUMA; TAJIMA, AKIMITSU; KONDO, HIDEAKI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 029451/0049 →
Assignment of Assignor's Interest Jan 11, 2013
From: SASAMURA, KEIICHI; MURATA, KOICHI; ISHIGURI, MASAHIKO; WATANABE, NAOYUKI
To: FUJITSU LIMITED
Reel/Frame 029614/0352 →
Assignment of Assignor's Interest Mar 25, 2013
From: NOMOTO, RYUJI; YONEDA, YOSHIYUKI; NAKAMURA, KOICHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 030077/0940 →
Assignment of Assignor's Interest Dec 30, 2014
From: OGAWA, HIROYUKI; YAMAGUCHI, AKIHISA
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 034598/0315 →
Assignment of Assignor's Interest Jan 28, 2015
From: FUJITSU LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 034833/0956 →
Change of Name Feb 25, 2015
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 035089/0853 →