IP Library Granted Patent US 8,991,464
Granted Patent B2
US 8,991,464 · App. 13/588,506 · Granted Mar 31, 2015

Method and apparatus for peeling electronic component

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Quick Facts
Patent No.
US 8,991,464
App. No.
13/588,506
Granted
Mar 31, 2015
Kind
B2
Abstract

A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

Claims (33)

1. A peeling apparatus for an electronic component that is adhered onto a tape member, comprising:

a bellowphragm that is arranged on a side of the tape member, opposite to a side on which the electronic component is provided;

a vacuum device that is arranged above the bellowphragm and that vacuums the electronic component;

a fluid supply device that supplies a fluid to the bellowphragm to deform the bellowphragm to thereby peel the electronic component from the tape member; and

a control unit that, on the basis of the detected vacuum state detected by a vacuum state detector and the detected contact force detected by a contact force detector, controls operation of the vacuum device, controls a pressure inside the vacuum device, or controls a pressure in a bellowphragm air chamber of the bellowphragm; and

a strain gauge that is arranged inside the vacuum device and detects a rate of rise per unit time in pressure inside the bellowphragm to measure a contact force by which the electronic component contacts the vacuum device.

2. The peeling apparatus for the electronic component according to claim 1 , wherein the vacuum device vacuums and holds the electronic component that is peeled from the tape member.

3. The peeling apparatus for the electronic component according to claim 1 , wherein

the vacuum device is connected through a vacuuming pipe to a vacuum source, and wherein

the vacuum state detector is provided in the vacuuming pipe.

4. The peeling apparatus for the electronic component according to claim 1 , wherein the contact force detector is provided for the vacuum device.

5. The peeling apparatus for the electronic component according to claim 1 , wherein a bellowphragm air chamber of the bellowphragm is separated into a plurality of portions.

6. The peeling apparatus for the electronic component according to claim 5 , wherein

the bellowphragm air chamber is formed of a hollow outer bellowphragm air chamber and an inner bellowphragm air chamber, and wherein

the inner bellowphragm air chamber is provided in a hollow portion of the outer bellowphragm air chamber so as to be substantially coaxial with the hollow portion.

7. The peeling apparatus for the electronic component according to claim 1 , further comprising,

a tape vacuum portion that is arranged to surround the bellowphragm and vacuums the tape member.

8. The peeling apparatus for the electronic component according to claim 1 , wherein the vacuum device includes a plurality of through-holes and the strain gauge is provided between one of the plurality of through-holes and another one of the plurality of through-holes.

9. A peeling apparatus for an electronic component that is adhered onto a tape member, comprising:

a bellowphragm that is arranged on a side of the tape member, opposite to a side on which the electronic component is provided;

a tape vacuum portion that is arranged around the bellowphragm and that vacuums the tape member;

a fluid supply device that supplies a fluid to the bellowphragm to deform the bellowphragm to thereby peel the electronic component from the tape member; and

a control unit that, on the basis of the detected vacuum state detected by a vacuum state detector and the detected contact force detected by a contact force detector, controls operation of the tape vacuum portion, controls a pressure inside the vacuum device, or controls a pressure in a bellowphragm air chamber of the bellowphragm,

wherein the bellowphragm air chamber is formed of a hollow outer bellowphragm air chamber and an inner bellowphragm air chamber, and wherein the inner bellowphragm air chamber is provided in a hollow portion of the outer bellowphragm air chamber so as to be substantially coaxial with the hollow portion.

10. The peeling apparatus for the electronic component according to claim 7 , wherein the bellowphragm air chamber and the tape vacuum portion are integrally formed.

11. A peeling apparatus for an electronic component that is adhered onto a tape member, comprising:

a bellowphragm that is arranged on a side of the tape member, opposite to a side on which the electronic component is provided;

a vacuum device that is arranged above the bellowphragm and that vacuums the electronic component;

a fluid supply device that supplies a fluid to the bellowphragm to deform the bellowphragm to thereby peel the electronic component from the tape member; and

a control unit that, on the basis of the detected vacuum state detected by a vacuum state detector and the detected contact force detected by a contact force detector, controls operation of the vacuum device, controls a pressure inside the vacuum device, or controls a pressure in a bellowphragm air chamber of the bellowphragm; and

a strain gauge that is arranged inside the vacuum device,

wherein the vacuum device includes a plurality of through-holes and the strain gauge is provided between one of the plurality of through-holes and an adjacent through-hole,

wherein the vacuum device includes a plurality of electronic component vacuum portions which are arranged alternately with the plurality of through-holes, and the strain gauge is provided above a central electronic component vacuum portion of the plurality of electronic component vacuum portions when viewed from any cross section.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035453/0904 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2012
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028828/0620 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2012
From: KONNO, YOSHITO; YAMADA, YUTAKA
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 028812/0265 →