Semiconductor device and method of manufacturing the same
View Patent ↗A semiconductor device is provided with: a semiconductor substrate; an insulation film formed above the semiconductor substrate; a pad formed on the insulation film, the pad including a trace; a first passivation film formed on the insulation film, located adjacent the pad, and separated from the pad; and a second passivation film formed on the first passivation film and the pad, the second passivation film covering the trace, and the second passivation film including an opening which exposes a part of the pad.
1. A semiconductor device comprising:
a semiconductor substrate;
an insulation film formed above the semiconductor substrate;
at least one pad formed on the insulation film, the pad including a trace of a probe;
a first passivation film formed on the insulation film, located adjacent the pad, and separated from the pad;
a second passivation film formed on the first passivation film and the pad, the second passivation film covering the trace of the probe, and the second passivation film including an opening which exposes a part of the pad; and
wherein the first passivation film includes a SiN film.
2. The semiconductor device according to claim 1 , wherein a plurality of the pads are arranged in one direction.
3. The semiconductor device according to claim 1 , wherein a shape of the opening is rectangular.
4. The semiconductor device according to claim 1 , wherein the second passivation film includes a SiN film.
5. A semiconductor device comprising:
a semiconductor substrate;
an insulation film formed above the semiconductor substrate;
at least one a pad formed on the insulation film, the pad including a trace of a probe;
a first passivation film formed on the insulation film, the first passivation film including a first opening, the pad being located in the first opening, and the pad being separated from the first passivation film;
a second passivation film formed on the first passivation film and the pad, the second passivation film covering the trace of the probe, and the second passivation film including a second opening which exposes a part of the pad; and
wherein the first passivation film includes a SiN film.
6. The semiconductor device according to claim 5 , wherein a plurality of the pads are arranged in one direction.
7. The semiconductor device according to claim 5 , wherein a shape of the second opening is rectangular.
8. The semiconductor device according to claim 5 , wherein the second passivation film includes a SiN film.
9. A semiconductor device comprising:
a semiconductor substrate;
an insulation film formed above the semiconductor substrate;
at least one pad formed on the insulation film, the pad including a trace of a probe;
a power line formed on the insulation film;
a wiring formed on the insulation film, the wiring being connected to the power line and the pad;
a first passivation film formed above the semiconductor substrate, located adjacent the pad, and separated from the pad; and
wherein the first passivation film includes a SiN film.
10. The semiconductor device according to claim 9 , wherein a plurality of the pads are arranged in one direction.
11. The semiconductor device according to claim 9 , wherein the first passivation film covers the power line and a part of the wiring.