SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device includes: a plurality of semiconductor chips to be mutually bonded via a bonding resin; a sealing resin to seal the plurality of semiconductor chips; and an anchor to be disposed in a first semiconductor chip included by the plurality of semiconductor chips and to seize the bonding resin.
1 . A semiconductor device comprising:
a plurality of semiconductor chips to be mutually bonded via a bonding resin;
a sealing resin to seal the plurality of semiconductor chips; and
an anchor to be disposed in a first semiconductor chip included by the plurality of semiconductor chips and to seize the bonding resin.
2 . The semiconductor device according to claim 1 , wherein the anchor includes a dummy wire bonded to between a substrate mounted with the plurality of semiconductor chips and the first semiconductor chip.
3 . The semiconductor device according to claim 1 , wherein the anchor includes a projection provided on the first semiconductor chip.
4 . The semiconductor device according to claim 1 , wherein the anchor is disposed at such an edge of the first semiconductor chip as to enable an edge of the bonding resin with an interface being formed between the bonding resin and the sealing resin to be seized outside an area formed with an electronic circuit on the surface of the first semiconductor chip.
5 . The semiconductor device according to claim 1 , wherein the anchor is disposed at a portion, of the first semiconductor chip, to which a wire for electrically connecting the substrate mounted with the plurality of semiconductor chips to the first semiconductor chip is not bonded.
6 . A manufacturing method of a semiconductor device, comprising:
a step of bonding a plurality of semiconductor chips mutually via a bonding resin;
a step of sealing the plurality of semiconductor chips by a sealing resin; and
a step of disposing an anchor to seize the bonding resin in a first semiconductor chip included by the plurality of semiconductor chips.
7 . The manufacturing method of the semiconductor device according to claim 6 , wherein the anchor includes a dummy wire bonded to between a substrate mounted with the plurality of semiconductor chips and the first semiconductor chip.
8 . The manufacturing method of the semiconductor device according to claim 6 , wherein the anchor includes a projection provided on the first semiconductor chip.
9 . The manufacturing method of the semiconductor device according to claim 6 , wherein the anchor is disposed at such an edge of the first semiconductor chip as to enable an edge of the bonding resin with an interface being formed between the bonding resin and the sealing resin to be seized outside an area formed with an electronic circuit on the surface of the first semiconductor chip.
10 . The manufacturing method of the semiconductor device according to claim 6 , wherein the anchor is disposed at a portion, of the first semiconductor chip, to which a wire for electrically connecting the substrate mounted with the plurality of semiconductor chips to the first semiconductor chip is not bonded.