Patent Assignment
Reel/Frame 030082/0151
Assignment of Assignor's Interest
Recorded: 2013-02-22
Pages: 4
Assignors
TAGAMI, SHOHEI
Executed: 2012-12-19
SUGO, MICHIHIRO
Executed: 2012-12-17
YASUDA, HIROYUKI
Executed: 2012-12-17
FURUYA, MASAHIRO
Executed: 2012-12-19
KATO, HIDETO
Executed: 2012-12-17
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Process Body, Wafer Processing Member, Wafer Processing Temporary Adhesive Material, and Method for Manufacturing Thin Wafer