Patent Assignment
Reel/Frame 030082/0198
Assignment of Assignor's Interest
Recorded: 2013-03-26
Pages: 4
Assignors
YANG, SU-CHUN
Executed: 2013-03-07
WU, CHUNG-JUNG
Executed: 2013-03-07
CHEN, HSIAO-YUN
Executed: 2013-03-07
HSIAO, YI-LI
Executed: 2013-03-07
TUNG, CHIH-HANG
Executed: 2013-03-08
SHIH, DA-YUAN
Executed: 2013-03-07
YU, CHEN-HUA
Executed: 2013-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Solder Bump Joint in a Device Including Lamellar Structures