Patent Assignment
Reel/Frame 030088/0222
Assignment of Assignor's Interest
Recorded: 2013-03-26
Pages: 7
Assignors
KANG, MYUNG-SUNG
Executed: 2013-02-18
KO, JUNG-MIN
Executed: 2013-02-18
PARK, SANG-SICK
Executed: 2013-02-19
KIM, WON-KEUN
Executed: 2013-02-18
HONG, JI-SEOK
Executed: 2013-02-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages, Methods of Manufacturing Semiconductor Packages, and Systems Including Semiconductor Packages