IP Library Assignment 030094/0570
Patent Assignment
Reel/Frame 030094/0570

Assignment of Assignor's Interest

Recorded: 2013-03-27 Pages: 3
Assignors
KAMGAING, TELESPHOR
Executed: 2013-03-06
ELSHERBINI, ADEL A.
Executed: 2013-03-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Single-Package Phased Array Module with Interleaved Sub-Arrays
Patent: 9,413,079 →
Application: 13/799,645 →
Publication: US 2014/0266902