IP Library Assignment 030096/0169
Patent Assignment
Reel/Frame 030096/0169

Assignment of Assignor's Interest

Recorded: 2013-03-27 Pages: 4
Assignors
TAKAGI, KOSUKE
Executed: 2013-03-14
TAKEBAYASHI, YUJI
Executed: 2013-03-14
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Evaporation System
Application: 13/850,735 →
Publication: US 2013/0267100
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →