Patent Assignment
Reel/Frame 047995/0462
Assignment of Assignor's Interest
Recorded: 2018-12-31
Pages: 13
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-12-05
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Properties
(136)
Substrate Processing System, Management Apparatus, Data Analysis Method
Application:
13/402,294 →
Publication:
US 2012/0226475
Substrate Processing Apparatus, Maintenance Method, and Maintenance Program
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Evaporation System
Application:
13/850,735 →
Publication:
US 2013/0267100
Substrate Processing Device
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Vaporization System
Application:
14/140,837 →
Publication:
US 2014/0182515
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Non-Transitory Computer-Readable Recording Medium
Substrate Processing Apparatus, Method of Controlling Substrate Processing Apparatus, Method of Maintaining Substrate Processing Apparatus, and Recording Medium
Substrate Processing System, Substrate Processing Apparatus, Data Processing Method, and Storage Medium
Application:
14/408,164 →
Publication:
US 2015/0148935
Integrated Management System, Management Device, Method of Displaying Information for Substrate Processing Apparatus, and Recording Medium
Application:
14/431,152 →
Publication:
US 2015/0253762
Substrate Processing Apparatus, Heating Apparatus, Ceiling Heat Insulator, and Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus, Substrate Processing Method, Semiconductor Device Manufacturing Method, and Control Program
Application:
14/650,074 →
Publication:
US 2015/0370245
Cleaning Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Recording Medium, and Cleaning Completion Determining Method
Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Application:
14/801,984 →
Publication:
US 2015/0325447
Substrate Processing Apparatus
Application:
14/804,653 →
Publication:
US 2016/0024650
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Method of Processing Substrate
Plasma Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Application:
14/848,634 →
Publication:
US 2016/0079101
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, and Recording Medium
Application:
14/856,312 →
Publication:
US 2016/0002789
Substrate Processing Apparatus, Gas-Purging Method, Method for Manufacturing Semiconductor Device, and Recording Medium Containing Abnormality-Processing Program
Management Apparatus, Substrate Processing System and Non-Transitory Computer-Readable Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Furnace Lid
Application:
14/949,714 →
Publication:
US 2016/0076149
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Application:
15/006,174 →
Publication:
US 2016/0276135
Substrate Processing Apparatus, and Thermocouple
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Device, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device and Recording Medium
Application:
15/075,707 →
Publication:
US 2016/0293421
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Application:
15/085,459 →
Publication:
US 2016/0322212
Substrate Processing Apparatus
Application:
15/097,382 →
Publication:
US 2016/0319424
Substrate Processing Apparatus and Furnace Opening Cover
Application:
15/128,139 →
Publication:
US 2017/0088948
Substrate Processing Apparatus, Non-Transitory Computer-Readable Recording Medium Thereof and Semiconductor Manufacturing Method by Employing Thereof
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device and Recording Medium
Substrate Processing Apparatus, and Storage Medium
Application:
15/187,300 →
Publication:
US 2016/0376699
Substrate Processing Apparatus and Guide Portion
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Substrate Processing Apparatus
Application:
15/255,352 →
Publication:
US 2017/0081764
Substrate Processing Apparatus Including Heating and Cooling Device, and Ceiling Part Included in the Same
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, and Recording Medium
Application:
15/273,875 →
Publication:
US 2017/0011974
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Application:
15/366,697 →
Publication:
US 2017/0159181
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device
Application:
15/383,903 →
Publication:
US 2017/0098561
Method for Manufacturing Semiconductor Device, Substrate-Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus
Application:
15/388,815 →
Publication:
US 2017/0183775
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Method of Processing Substrate Recording Medium, and Method of Manufacturing Semiconductor Device
Application:
15/421,162 →
Publication:
US 2017/0221698
Substrate Processing Apparatus
Substrate Processing Apparatus and Precursor Gas Nozzle
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Substrate Processing Apparatus Capable of Adjusting Flow Rate of Inert Gas Supplied to Substrate
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Recording Medium
Semiconductor Device Manufacturing Method, Substrate Processing Apparatus and Recording Medium
Substrate Processing Apparatus
Application:
15/459,772 →
Publication:
US 2017/0183770
Method of Manufacturing Semiconductor Device Having Air Gap Between Wirings for Low Dielectric Constant
Processing Apparatus, Controller and Processing System
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device Using Plasma to Modify Surface of Silicon-Containing Films Exposed in Trench Structure, and Recording Medium
Substrate Processing Apparatus, Device Management Controller, and Recording Medium
Substrate Processing Apparatus
Substrate Processing in a Process Chamber for Semiconductor Manufacturing and Apparatus Management Controller with Error Analysis
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus
Application:
15/499,559 →
Publication:
US 2017/0271176
Substrate Processing Device, Manufacturing Method for Semiconductor Device, and Reaction Tube
Method of Manufacturing Semiconductor Device
Application:
15/513,415 →
Publication:
US 2017/0309490
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device
Semiconductor Device Manufacturing Method, Substrate Processing Apparatus, and Recording Medium
Semiconductor Device Manufacturing Method and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Teaching Jig, Substrate Processing Apparatus, and Teaching Method
Substrate Processing Apparatus, Lid Cover and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Treatment Apparatus Including Reaction Tube with Opened Lower End, Furnace Opening Member, and Flange Configured to Cover Upper Surface of the Furnace Opening Member
Substrate Processing Apparatus, Recording Medium, and Fluid Circulation Mechanism
Method of Manufacturing Semiconductor Device
Substrate-Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus
Application:
15/687,950 →
Publication:
US 2018/0277405
Substrate Processing Apparatus, Nozzle Base, and Manufacturing Method for Semiconductor Device
Substrate Processing Apparatus
Substrate Processing Apparatus
Substrate Processing Apparatus
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus and Heat Insulating Pipe Structure
Application:
15/706,028 →
Publication:
US 2018/0087709
Substrate Processing Apparatus and Recording Medium
Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Thermocouple Support
Reaction Tube Structure and Substrate Processing Apparatus
Substrate Processing Apparatus, Exhaust System and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device and Vaporizer
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Baffle Structure of the Substrate Processing Apparatus
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Application:
15/902,532 →
Publication:
US 2018/0179628
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Recording Medium, and Supply System
Substrate Processing Apparatus, and Method for Manufacturing Semiconductor Device
Method of Processing Substrate
Substrate Processing Apparatus
Substrate Processing Apparatus, Vaporization System and Mist Filter
Substrate Processing Apparatus
Method of Processing Substrate, Substrate Processing Apparatus, Recording Medium, and Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Gas Supply System, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Application:
15/923,796 →
Publication:
US 2018/0202043
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing System, Substrate Processing Apparatus and Management Device
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Recording Medium
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method for Manufacturing Semiconductor Device, Non-Transitory Computer-Readable Recording Medium, and Substrate Processing Apparatus
Substrate Retrainer and Substrate Processing Apparatus
Application:
15/940,296 →
Publication:
US 2018/0286725
Method for Manufacturing Semiconductor Device, Substrate-Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Application:
15/961,277 →
Publication:
US 2018/0247819
Method of Manufacturing Semiconductor Device
Substrate Processing Apparatus, Substrate Container Transport System and Operation Mechanism
Substrate Processing Apparatus
Application:
16/023,820 →
Publication:
US 2018/0305816
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2012
From: ASAI, KAZUHIDE
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 028163/0680 →
Assignment of Assignor's Interest
Mar 27, 2013
From: TAKAGI, KOSUKE; TAKEBAYASHI, YUJI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 030096/0169 →
Assignment of Assignor's Interest
Apr 1, 2013
From: YONEDA, AKIHIKO; KOTANI, HIROSHI; MIZUGUCHI, YASUHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 030124/0528 →
Assignment of Assignor's Interest
Mar 10, 2014
From: OKUNO, MASANORI; KATAOKA, HISAKI; MIYADA, TOMOYUKI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 032394/0920 →
Assignment of Assignor's Interest
Jun 2, 2014
From: OHNO, MIKIO; TAKAGI, KOSUKE; AKAE, NAONORI; TERASAKI, MASATO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 033009/0898 →
Assignment of Assignor's Interest
Jun 30, 2014
From: YAMAZAKI, HIROHISA; TAKEBAYASHI, YUJI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 033209/0967 →
Assignment of Assignor's Interest
Dec 16, 2014
From: KOSHIMAKI, TOSHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 034514/0735 →
Assignment of Assignor's Interest
Dec 24, 2014
From: NISHIURA, SUSUMU; INOSHIMA, KAORI; MITSUI, HIROYUKI; EKKO, HIROSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 034583/0708 →
Assignment of Assignor's Interest
Feb 5, 2015
From: KOSUGI, TETSUYA; TAKEWAKI, MOTOYA; UENO, MASAAKI; MURATA, HITOSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 034900/0448 →
Assignment of Assignor's Interest
Mar 26, 2015
From: NAKANO, MINORU; SAITOH, TSUYOSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 035260/0521 →
Assignment of Assignor's Interest
Jul 2, 2015
From: YANAI, HIDEHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 035971/0734 →
Assignment of Assignor's Interest
Jul 2, 2015
From: SUGISHITA, MASASHI; URANO, YUUJI; MAEDA, KIYOHIKO; UENO, MASAAKI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 035973/0059 →
Assignment of Assignor's Interest
Jul 17, 2015
From: OGAWA, ARITO; HARADA, KAZUHIRO; KAGA, YUKINAO; ITATANI, HIDEHARU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036121/0462 →
Assignment of Assignor's Interest
Jul 21, 2015
From: TOYODA, KAZUYUKI; ASHIHARA, HIROSHI; SANO, ATSUSHI; AKAE, NAONORI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036143/0644 →
Assignment of Assignor's Interest
Aug 5, 2015
From: MORITA, OSAMU; MORI, SHINICHIRO; KAMEDA, KENJI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036253/0254 →
Assignment of Assignor's Interest
Aug 14, 2015
From: INADA, TETSUAKI; WADA, YUICHI; ISHISAKA, MITSUNORI; HIRANO, MITSUHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036331/0570 →
Assignment of Assignor's Interest
Aug 28, 2015
From: YANAI, HIDEHIRO; HIYAMA, SHIN; SHIMADA, TOSHIYA; ABURATANI, YUKINORI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036447/0214 →
Assignment of Assignor's Interest
Sep 4, 2015
From: NITTA, TAKAFUMI; SHIMAMOTO, SATOSHI; HIROSE, YOSHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036497/0004 →
Assignment of Assignor's Interest
Sep 9, 2015
From: YANAI, HIDEHIRO; YANAGISAWA, YOSHIHIKO; TSUBOTA, YASUTOSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036519/0673 →
Assignment of Assignor's Interest
Sep 17, 2015
From: KONTANI, TADASHI; TATENO, HIDETO; UMEKAWA, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036587/0369 →