IP Library Assignment 036331/0570
Patent Assignment
Reel/Frame 036331/0570

Assignment of Assignor's Interest

Recorded: 2015-08-14 Pages: 12
Assignors
INADA, TETSUAKI
Executed: 2015-07-29
WADA, YUICHI
Executed: 2015-07-30
ISHISAKA, MITSUNORI
Executed: 2015-07-30
HIRANO, MITSUHIRO
Executed: 2015-07-29
HORII, SADAYOSHI
Executed: 2015-07-29
ITATANI, HIDEHARU
Executed: 2015-07-29
TAKANO, SATOSHI
Executed: 2015-07-30
TAKEBAYASHI, MOTONARI
Executed: 2015-07-30
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Method of Processing Substrate
Application: 14/826,756 →
Publication: US 2016/0053373
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →