Substrate processing apparatus
There is provided a substrate processing apparatus which includes: a processing container in which a substrate is accommodated; a substrate supporting part configured to support the substrate inside the processing container and including a support electrode; an upper electrode installed to face the substrate supporting part; a first impedance control part having one end connected to the upper electrode; a second impedance control part having one end connected to the support electrode; a processing gas supply part configured to supply a processing gas to the substrate; an activation part configured to activate the processing gas, the activation part being installed outside the processing container and being connected to a power supply part via an insulating part; and a third impedance control part having one end connected between the insulating part and the activation part.
1. A substrate processing apparatus, comprising:
a processing container in which a substrate is accommodated;
a substrate supporting part configured to support the substrate inside the processing container and including a support electrode;
an upper electrode installed to face the substrate supporting part;
a first impedance control part having one end connected to the upper electrode;
a second impedance control part having one end connected to the support electrode;
a processing gas supply part configured to supply a processing gas to the substrate;
an activation part configured to activate the processing gas, the activation part being installed outside the processing container and being connected to a power supply part via an insulating part; and
a third impedance control part having one end connected between the insulating part and the activation part.
2. The substrate processing apparatus of claim 1 , further comprising: a first potential portion connected to another end of the first impedance control part and having a potential different from an earth potential; a second potential portion connected to another end of the second impedance control part and having a potential different from the earth potential; and a third potential portion connected to another end of the third impedance control part and having a potential different from the earth potential.
3. The substrate processing apparatus of claim 2 , further comprising: a common potential portion to which the first potential portion, the second potential portion and the third potential portion are connected.
4. The substrate processing apparatus of claim 1 , further comprising: a control part configured to set a first impedance of the first impedance control part, a second impedance of the second impedance control part, a third impedance of the third impedance control part, and a power of the power supply part.
5. The substrate processing apparatus of claim 2 , further comprising: a control part configured to set a first impedance of the first impedance control part, a second impedance of the second impedance control part, a third impedance of the third impedance control part, and a power of the power supply part.
6. The substrate processing apparatus of claim 3 , further comprising: a control part configured to set a first impedance of the first impedance control part, a second impedance of the second impedance control part, a third impedance of the third impedance control part, and a power of the power supply part.
7. The substrate processing apparatus of claim 4 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a first setting in which the second impedance is larger than the first impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
8. The substrate processing apparatus of claim 5 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a first setting in which the second impedance is larger than the first impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
9. The substrate processing apparatus of claim 6 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a first setting in which the second impedance is larger than the first impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
10. The substrate processing apparatus of claim 4 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a second setting in which the first impedance and the second impedance are larger than the third impedance, and the power is supplied to the activation part to activate the processing gas.
11. The substrate processing apparatus of claim 7 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a second setting in which the first impedance and the second impedance are larger than the third impedance, and the power is supplied to the activation part to activate the processing gas.
12. The substrate processing apparatus of claim 4 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a third setting in which the first impedance is larger than the second impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
13. The substrate processing apparatus of claim 7 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a third setting in which the first impedance is larger than the second impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
14. The substrate processing apparatus of claim 10 , wherein the control part controls the first impedance control part, the second impedance control part, the third impedance control part, the activation part and the power supply part such that the setting of the impedance is set to a third setting in which the first impedance is larger than the second impedance and the third impedance, and the power is supplied to the activation part to activate the processing gas.
15. The substrate processing apparatus of claim 14 , wherein the control part controls the substrate to be subjected a first process with a first setting, and subsequently, a second process with the second setting or a third process with the third setting.