SUBSTRATE PROCESSING APPARATUS AND HEAT INSULATING PIPE STRUCTURE
A configuration including a process chamber for processing a substrate, a gas supply system including supply pipe for supplying a source gas into the process chamber, and an exhaust system including exhaust pipe for discharging an exhaust gas containing the source gas from the process chamber, in which at least one of the supply pipe and the exhaust pipe includes an inner pipe constituting a first flow path of the source gas or the exhaust gas, a member provided outside the inner pipe and constituting a second flow path between the member and an outer wall of the inner pipe, and an outer pipe provided surrounding the inner pipe in order to provide a space between the outer pipe and an outside of the member.
1 . A substrate processing apparatus, comprising:
a process chamber for processing a substrate; a gas supply system including supply pipe for supplying a source gas into the process chamber; and an exhaust system including exhaust pipe for discharging an exhaust gas containing the source gas from the process chamber, wherein
at least one of the supply pipe and the exhaust pipe includes: an inner pipe constituting a first flow path of the source gas or the exhaust gas; a member provided outside the inner pipe and constituting a second flow path between the member and an outer wall of the inner pipe; and an outer pipe provided surrounding the inner pipe in order to provide a space between the outer pipe and an outside of the member.
2 . The substrate processing apparatus according to claim 1 , further comprising: a supply/discharge mechanism for supplying and discharging a fluid through the second flow path; a heat insulating mechanism for bringing the space into a vacuum state and thermally insulating the inner pipe from outside air; and a control unit for controlling the heat insulating mechanism and the supply/discharge mechanism such that the inner pipe is heated and cooled to a predetermined temperature by controlling supply/discharge of the fluid flowing in the second flow path and an atmosphere of the space.
3 . The substrate processing apparatus according to claim 1 , wherein the space is in contact with at least a part of the outer wall of the inner pipe, and the second flow path is provided in a spiral shape along the outer wall of the inner pipe.
4 . A heat insulating pipe structure comprising: an inner pipe constituting a flow path of a source gas or an exhaust gas; a member provided outside the inner pipe and constituting a second flow path between the member and an outer wall of the inner pipe; and an outer pipe provided surrounding the inner pipe in order to provide a space between the outer pipe and the member.
5 . A heat insulating pipe structure comprising: an inner pipe constituting a flow path of a source gas or an exhaust gas; and an outer pipe provided surrounding the inner pipe and having a space inside, wherein
the outer pipe is configured to have a first space provided covering the inner pipe and including a second flow path for circulating a fluid for heating and cooling the inner pipe, and a second space provided covering the first space and capable of being vacuum-exhausted or vacuum-sealed, isolated from each other.
6 . The substrate processing apparatus according to claim 1 , wherein the outer pipe is configured to have a first space including a second flow path for circulating a fluid for heating and cooling the inner pipe and a second space capable of being vacuum-exhausted or vacuum-sealed.
7 . The substrate processing apparatus according to claim 2 , further comprising a heating mechanism for heating the fluid or a cooling mechanism for cooling the fluid,
wherein the fluid is configured to be heated or cooled to a predetermined temperature in advance.
8 . The substrate processing apparatus according to claim 7 , wherein the inner pipe is configured to be heated and cooled according to a temperature of a fluid supplied to the second flow path.
9 . The substrate processing apparatus according to claim 2 , wherein the control unit is configured to supply the fluid from a vacuum state to the second space, transmit heat of a wall of the inner pipe to the fluid of the second space, and promote lowering of the temperature when lowering a temperature of the inner pipe.
10 . The substrate processing apparatus according to claim 2 , wherein the control unit is configured to adjust each of a temperature of the pipe at the time of substrate processing and a temperature of the pipe at the time of maintenance to a predetermined temperature.
11 . The substrate processing apparatus according to claim 2 , wherein the fluid is air or any one gas selected from the group consisting of N2, He, Ne, Ar, Cr, and Xe.
12 . The heat insulating pipe structure according to claim 5 , configured such that the first space is in contact with at least a part of the outer wall of the inner pipe and the flow path included in the first space is provided in a spiral shape along the outer wall of the inner pipe.
13 . The heat insulating pipe structure according to claim 5 , wherein the outer pipe has a sealed structure capable of vacuum-exhausting and vacuum-sealing the second space.
14 . The heat insulating pipe structure according to claim 5 , further comprising a heating unit for heating the inner pipe in the first space, wherein
the heating unit is configured to be wound around the outer wall of the inner pipe in a spiral shape.