Method of manufacturing semiconductor device having air gap between wirings for low dielectric constant
A method of manufacturing a semiconductor device includes: (a) loading into a process chamber a substrate including: a wiring layer including a first interlayer insulating film, a plurality of copper-containing films formed on the first interlayer insulating film and used as a wiring, an inter-wire insulating film electrically insulating the plurality of copper containing film and a recess formed between the plurality of copper-containing film; and a first diffusion barrier film formed on a first portion of a surface of the plurality of copper-containing films to suppress a diffusion of a component of the plurality of copper-containing film; and (b) supplying a silicon-containing gas into the process chamber to form a silicon-containing film on: a surface of the recess; and a second portion of the surface of the plurality of copper-containing films other than the first portion where the first diffusion barrier film is formed.
1. A method of manufacturing a semiconductor device, comprising:
(a) loading into a process chamber a substrate comprising: a wiring layer comprising a first interlayer insulating film, a plurality of copper-containing films formed on the first interlayer insulating film and used as a wiring, an inter-wire insulating film electrically insulating the plurality of copper containing film and a recess formed between the plurality of copper-containing film; and a first diffusion barrier film formed on a first portion of a surface of the plurality of copper-containing films to suppress a diffusion of a component of the plurality of copper-containing film;
(b) supplying a first silicon-containing gas containing chlorine and silicon into the process chamber to form a first silicon-containing film containing chlorine and silicon on: a surface of the recess; and a second portion of the surface of the plurality of copper-containing films other than the first portion where the first diffusion barrier film is formed;
(c) supplying a second silicon-containing gas containing hydrogen and silicon into the process chamber after performing (b) to form a second silicon-containing film, wherein the second silicon-containing gas is different from the first silicon-containing gas, chlorine is removed from the first silicon-containing film by attaching hydrogen to chlorine in the first silicon-containing film, and silicon is attached to the first silicon-containing film in place of chlorine removed by hydrogen; and
(d) supplying a modifying gas into the process chamber after performing (c) to form a second diffusion barrier film by modifying the second silicon-containing film to suppress the diffusion of the component of the plurality of copper-containing films from the second portion, wherein the substrate is maintained at a temperature whereat a diffusion of silicon contained in the second silicon-containing film into the plurality of copper-containing films is suppressed.
2. The method of claim 1 , wherein the modifying gas nitrides the second silicon-containing film in (d).
3. The method of claim 2 , wherein the second silicon-containing film is nitrided by a nitrogen-containing gas in plasma state in (d).
4. The method of claim 1 , wherein (b) and (c) are repeated.
5. The method of claim 1 , further comprising:
(e) forming a second interlayer insulating film on the wiring layer; and
(f) polishing the second interlayer insulating film.