IP Library Granted Patent US 10,228,291
Granted Patent B2
US 10,228,291 · App. 15/052,137 · Granted Mar 12, 2019

Substrate processing apparatus, and thermocouple

Inventors: Akihiro Osaka (Toyama, JP); Hideto Yamaguchi (Toyama, JP); Tetsuya Kosugi (Toyama, JP); Tokunobu Akao (Toyama, JP); Atsushi Umekawa (Toyama, JP); Motoya Takewaki (Toyama, JP)
Assignee: KOKUSAI ELECTRIC CORPORATION
G01K1/08G01K7/02
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,228,291
App. No.
15/052,137
Granted
Mar 12, 2019
Kind
B2
Abstract

A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.

Claims (31)

1. A temperature sensor, comprising:

a temperature measuring portion configured to measure an internal temperature of a reaction tube;

a main body portion provided therein with the temperature measuring portion that is located to face a heating part for heating an interior of the reaction tube;

an intermediate member fixed to the main body portion at a location on an opposite side where the temperature measuring portion is provided, at least a portion of the intermediate member being located at a height position where the temperature measuring portion is provided; and

a cushioning member installed immediately above or below a height position where the intermediate member is installed, the cushioning member attached to the main body portion by winding around the main body portion in multiple turns,

wherein a space portion is formed between a protective member and the temperature measuring portion, and

wherein the intermediate member makes contact with the reaction tube by pressing the cushioning member by the protective member against the reaction tube.

2. The temperature sensor of claim 1 , wherein the intermediate member is configured to cover at least a part of the main body portion.

3. The temperature sensor of claim 2 , wherein the intermediate member has a plate shape.

4. The temperature sensor of claim 1 , wherein the cushioning member is configured to fill the space portion.

5. A substrate processing apparatus for accommodating a plurality of substrates within a reaction tube and processing the substrates, comprising:

a heating part configured to heat an interior of the reaction tube; and

a temperature sensor including:

a temperature measuring portion configured to measure an internal temperature of the reaction tube;

a main body portion provided therein with the temperature measuring portion located to face the heating part for heating an interior of the reaction tube;

an intermediate member fixed to the main body portion at a location on an opposite side where the temperature measuring portion is provided, at least a portion of the intermediate member being located at a height position where the temperature measuring portion is provided;

a cushioning member installed immediately above or below a height position where the intermediate member is installed, the cushioning member attached to the main body portion by winding around the main body portion in multiple turns; and

wherein a space portion is formed between a protective member and the temperature measuring portion, and

wherein the intermediate member makes contact with the reaction tube by pressing the cushioning member by the protective member against the reaction tube.

6. The apparatus of claim 5 , further comprising:

a substrate holding member configured to horizontally hold the substrates in multiple stages,

wherein the protective member is configured to cover at least a substrate processing region where the substrates are held by the substrate holding member.

7. The apparatus of claim 5 , wherein the cushioning member is configured to fill the space portion.

8. The apparatus of claim 5 , wherein the cushioning member is configured to be interposed between the main body portion and the protective member.

9. The apparatus of claim 5 , wherein the temperature sensor includes a first temperature sensor including a first main body portion provided with a first temperature measuring portion for measuring a temperature of a ceiling of the reaction tube, and

wherein the first main body portion is configured to make contact with a surface of the ceiling of the reaction tube.

10. The apparatus of claim 9 , wherein the first main body portion includes a projection portion to fix the first temperature measuring portion to a central position of the ceiling of the reaction tube.

11. The apparatus of claim 10 , wherein the protective member includes a first protective member having an opening portion, which is configured to position the first temperature measuring portion of the first temperature sensor at a center of the ceiling of the reaction tube by inserting the projection portion into the opening portion.

12. The apparatus of claim 9 , wherein the first temperature sensor further includes:

a second main body portion installed on a side surface of the reaction tube, and provided therein with a wire which constitutes the first temperature measuring portion; and

a connection portion configured to interconnect the first main body portion and the second main body portion, and formed by winding an insulation member around the wire.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2016
From: OSAKA, AKIHIRO; KOSUGI, TETSUYA; AKAO, TOKUNOBU; UMEKAWA, ATSUSHI; TAKEWAKI, MOTOYA; YAMAGUCHI, HIDETO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 038368/0912 →
Priority Claims (2)
JP 2015-035680 · Feb 25, 2015 · national
JP 2016-021846 · Feb 8, 2016 · national
Continuity (1)
Related Publication 20160245704A1 · Aug 25, 2016