Substrate processing apparatus
Described herein is a technique capable of suppressing a generation of particles. A substrate processing apparatus may include: a substrate support including: a protruding portion supporting a substrate including a pattern region at a center thereof and a non-contacting region at a periphery thereof; and a bottom portion defining a space along with the protruding portion; a process chamber wherein the substrate support is provided and the substrate is processed; a process gas supply unit configured to supply a process gas into the process chamber; and a hot gas supply unit configured to heat and supply an inert gas into the space.
1. A substrate processing apparatus comprising:
a substrate support comprising:
a ring-shaped protruding portion supporting a substrate including a pattern region at a center thereof and a non-contacting region at a periphery thereof; and
a bottom portion defining a space along with the ring-shaped protruding portion;
a process chamber wherein the substrate support is provided and the substrate is processed;
a process gas supply unit configured to supply a process gas into the process chamber; and
a hot gas supply unit configured to heat and supply an inert gas into the space; and
at least one hole penetrating a side surface of the ring-shaped protruding portion.
2. The substrate processing apparatus of claim 1 , wherein the hot gas supply unit comprises: a supply pipe connected to the bottom portion; and a heating unit installed at the supply pipe and configured to heat the inert gas in the supply pipe.
3. The substrate processing apparatus of claim 2 , wherein the space is provided at least below a back surface of the pattern region and a back surface of the non-contacting region.
4. The substrate processing apparatus of claim 3 , further comprising a dispersion plate disposed between an upper end of the ring-shaped protruding portion and the bottom portion.
5. The substrate processing apparatus of claim 4 , wherein the dispersion plate is parallel to the substrate.
6. The substrate processing apparatus of claim 2 , further comprising a dispersion plate disposed between an upper end of the ring-shaped protruding portion and the bottom portion.
7. The substrate processing apparatus of claim 6 , wherein the dispersion plate is parallel to the substrate.
8. The substrate processing apparatus of claim 1 , wherein the space is provided at least below a back surface of the pattern region and a back surface of the non-contacting region.
9. The substrate processing apparatus of claim 8 , further comprising a dispersion plate disposed between an upper end of the ring-shaped protruding portion and the bottom portion.
10. The substrate processing apparatus of claim 9 , wherein the dispersion plate is parallel to the substrate.
11. The substrate processing apparatus of claim 8 , further comprising a dispersion plate disposed between an upper end of the ring-shaped protruding portion and the bottom portion.
12. The substrate processing apparatus of claim 11 , wherein the dispersion plate is parallel to the substrate.