Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
In the present invention, the productivity of a processing apparatus including a plurality of process chambers is improved. There is provided a substrate processing apparatus including a plurality of process chambers, a process gas supply unit configured to supply a process gas into each of the plurality of process chambers, a purge gas supply unit configured to supply a purge gas into each of the plurality of process chambers, an exhaust unit configured to exhaust each of the plurality of process chambers and a control unit configured to control the process gas supply unit, the purge gas supply unit and the exhaust unit to supply the process gas into a first process chamber of the plurality of process chambers to which a substrate is transferred while supplying the purge gas into process chambers other than the first process chamber and exhausting the plurality of process chambers.
1. A method of manufacturing a semiconductor device in a substrate processing apparatus comprising a first chamber including a first substrate placement unit whereon a first substrate is placed and a second chamber including a second substrate placement unit whereon a second substrate is placed, the method, comprising:
(a) transferring only the first substrate into the first chamber without the second substrate loaded in the second chamber;
(b) simultaneously:
supplying a process gas onto the first substrate in the first chamber; and
exhausting the process gas from the first chamber through a first exhaust pipe connected to the first chamber; and
(c) simultaneously:
supplying a purge gas onto a surface of the second substrate placement unit disposed in the second chamber; and
exhausting the purge gas from the second chamber through a second exhaust pipe connected to the second chamber, while adjusting at least one of a flow rate of the purge gas and a conductance of a second exhaust pipe connected to the second chamber such that the conductance of the second exhaust pipe is the same as that of the first exhaust pipe,
wherein (b) and (c) start simultaneously after performing (a), and end simultaneously, and
the first exhaust pipe and the second exhaust pipe are exhausted by a single exhaust unit in (b) and (c).
2. The method of claim 1 , wherein an amount of the purge gas supplied onto the surface of the second substrate placement unit in (c) is equal to that of the process gas supplied onto the first substrate in (b).
3. The method of claim 1 , wherein a second process gas is further supplied a predetermined number of times in (b) in alternate manner, and
the purge gas is continuously supplied in (c) from a start of supplying the first process gas or the second process gas until the first process gas or the second process gas is supplied the predetermined number of times.
4. The method of claim 2 , wherein a second process gas is further supplied a predetermined number of times in (b) in alternate manner, and
the purge gas is continuously supplied in (c) from a start of supplying the first process gas or the second process gas until the first process gas or the second process gas is supplied the predetermined number of times.
5. The method of claim 1 , wherein an amount of power supplied to a second heating unit installed in the second substrate placement unit is greater than that of power supplied to a first heating unit installed in the first substrate placement unit in (c).
6. The method of claim 2 , wherein an amount of power supplied to a second heating unit installed in the second substrate placement unit is greater than that of power supplied to a first heating unit installed in the first substrate placement unit in (c).
7. The method of claim 1 , wherein a second heating unit installed in the second substrate placement unit is turned off and a first heating unit installed in the first substrate placement unit is turned on in (c).
8. The method of claim 2 , wherein a second heating unit installed in the second substrate placement unit is turned off and a first heating unit installed in the first substrate placement unit is turned on in (c).
9. The method of claim 1 , further comprising:
(d) placing the second substrate on the second substrate placement unit with the first substrate placed on the first substrate placement unit; and
(e) supplying the process gas onto the second substrate and exhausting the process gas from the second chamber through the second exhaust pipe after performing (d).
10. The method of claim 1 , wherein (c) is performed without the process gas being supplied onto the second substrate placement unit.