Merger

Recorded: 2013-03-28 Pages: 7

Assignor

Executed: 2010-01-13

Assignee

UNIMICRON TECHNOLOGY CORP.

38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Packaging Substrate Structure with Electronic Component Embedded Therein and Method for Manufacture of the Same

Patent: 8,436,463 →

Application: 12/230,345 →

Publication: US 2009/0057873

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.