Patent Assignment
Reel/Frame 030117/0289
Assignment of Assignor's Interest
Recorded: 2013-03-13
Pages: 3
Assignors
SUEHIRO, YOSHINOBU
Executed: 2013-02-14
WADA, SATOSHI
Executed: 2013-02-14
TASUMI, KOJI
Executed: 2013-02-14
Assignee
TOYODA GOSEI CO., LTD.
1 HARUHINAGAHATA, KIYOSU-SHI, AICHI-KEN, 452-8564, JAPAN
Covered Property
(1)
Solid-State Device Including a Conductive Bump Connected to a Metal Pattern and Method of Manufacturing the Same