Patent Assignment
Reel/Frame 030139/0389
Assignment of Assignor's Interest
Recorded: 2013-04-03
Pages: 9
Assignors
HSUEH, CHIH HUNG
Executed: 2013-03-14
WANG, WEI-TE
Executed: 2013-03-14
CHEN, SHAO-YU
Executed: 2013-03-14
FAN, CHUN-LIANG
Executed: 2013-03-14
TSAI, KUAN-CHI
Executed: 2013-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Process of Ultra Thick Trench Etch with Multi-Slope Profile