IP Library Assignment 030139/0398
Patent Assignment
Reel/Frame 030139/0398

Assignment of Assignor's Interest

Recorded: 2013-04-02 Pages: 3
Assignors
MOHAMMED,ILYAS
Executed: 2006-01-30
HABA, BELGACEM
Executed: 2006-02-01
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Stacked Microelectronic Packages Having at Least Two Stacked Microelectronic Elements Adjacent One Another
Patent: 8,890,327 →
Application: 13/246,242 →
Publication: US 2012/0013028
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →